Main Tasks and Responsibilities
1. Handles fully or assist in placement, routing and Stackup creation for High speed PCB’s for interconnect
2. Performs 2D/3D simulation of high-speed traces for high speed board’s
3. Conduct Frequency and time measurement using VNA
4. Other duties as assigned
Skills, Competencies and Knowledge
1. In depth knowledge of High-speed material types and characteristics
2. In depth knowledge of parameters affecting the accuracy of simulation
3. In depth knowledge in RF connectors, transition via and BGA via optimization techniques
4. Skilled in securing optimum signal integrity performance and solutions for interconnects going from
5. design to fabrication and post fabrication analysis.
6. Extended experience with VNA measurement and lab equipment
Educational Background and Experience
1. CCE, electronics Engineering, microwave Engineering or any related field
2. 1 year experience, oriented SIGNAL INTEGRITY ENGINEER
Work Environment
Office, Lab